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Aeroflex Plainview for over thirty years has been a leader in the microelectronic packaging arena. Their MCM technology is designed to operate in severe environments where performance, size and weight are the most critical parameters. A variety of substrate interconnect technologies such as thick film, thin film, LTCC, aluminum nitride, BeO, or pwb can be used to provide miniature size, high frequency and thermal management performance gains. Optimum use of assembly methods such as Chip on Board (COB), Chip and Wire, Surface Mount Technology (SMT) and plastic packaging. Using Aeroflex designed mixed-signal integrated circuits, FPGAs, or custom ICs, your custom ASICs or off-the-shelf components, solutions are available for your demanding applications. From DC to Light, Aeroflex can provide electronic design and test solutions for high speed digital, fiber optic, RF and Microwave applications for military, telecom, sensor, and medical applications.
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